ABOUT SNTPCB
ELECTRONIC COMPONENT SUPPLY & PCB & PCBA
TURNKEY EXPERT
SNT focus on high-quality and economically viable systems combined with unmatched consistency has made us of your best choice.
With customer-centricity,SNT provides turnkey stop for infinite solutions,from customized designs to PCB layouts,from power stencils to soldering solutions,from fabrication to assembly,from heatsinks & mounting kits to thyristors & triacs,from varistors to switches,from capacitors to rectifiers,to thousands of small and large components that are required to build your state-of-the-art PCB.
Our team of creative,experienced and highly competent staffs at SNTPCB take care of customers across the globe,delivering quality every single time.
Hot Featured Products
PCB OEM & ODM
MULTILAYER PCB
HDI PCB
METAL CORE PCB
REGID-FLEX PCB
FLEXIBLE PCB
PCB ASSEMBLY
COMPANY PROFILE
Corporate Presentation & Technical Capabilities
1. Executive Summary & Core Values
At SNT, our focus on high-quality, economically viable systems combined with unmatched consistency makes us your premier choice. With a customer-centric mindset, SNT provides a turnkey stop for infinite solutions-from customized designs and PCB layouts to power stencils, soldering, fabrication, assembly, heatsinks, thyristors, triacs, varistors, switches, capacitors, and rectifiers.
Our core organizational values drive every project:
1.1 Sincerity: Building transparent, long-term partnerships with complete integrity.
1.2 Flexibility: Adapting seamlessly to customized client designs and changing requirements.
1.3 Implementation: Executing manufacturing workflows with absolute precision and speed.
1.4 Innovation: Continuously refining technology to deliver state-of-the-art PCB solutions.
2. Electronics Manufacturing Services (EMS) & Capabilities
SNT delivers an end-to-end service suite engineered to streamline your production lifecycle:
2.1 PCB Fabrication & Prototyping: Production ranging from standard boards to ultra-high layer counts.
2.2 PCB Assembly (PCBA): Advanced SMT and Through-Hole assembly for fine-pitch BGA components.
2.3 Engineering Assistance: Comprehensive DFM and DFA support to optimize design efficiency and yield.
2.4 Test & Inspection Services: Full E-test, AOI, and functional testing to guarantee zero-defect delivery.
2.5 Electronic Parts Supply & Logistics: Robust supply chain management for active and passive components.
3. Material Capabilities & Surface Finishes
We maintain a versatile substrate inventory and offer precise surface finishing options:
3.1 Base Substrates: Standard FR4 (Shengyi, ITEQ, KB A+), High-TG, Fr06, and RF materials including Rogers, Taconic, Argon, Naclo, and Isola.
3.2 Specialized Product Types: High-Frequency (HF/RF) boards, Controlled Impedance, HDI, and BGA/Fine-Pitch boards.
3.3 Solder Mask Options: Premier Nanya & Taiyo LPI or Matt finishes in red, green, yellow, white, blue, and black.
3.4 Surface & Selective Finishes: HASL, Lead-Free HASL, ENIG, OSP, Immersion Tin/Silver, Hard Gold, and hybrid combinations (e. g., ENIG + Gold Finger).
4. Technical Specifications
Technical Parameter / Specification Limits
Layer Count 1 - 28 Layers
Copper Thickness 1 - 6 oz
Min. Line Width / Gap 3.5 / 4 mil (Laser Drill)
Min. Hole Size 0.15 mm (Mechanical) / 4 mil (Laser)
Min. Annular Ring 4 mil
Max. Production Size 600 mm × 800 mm
Board Thickness (D/S & Multilayer) Double: 0.2-7.0 mm Multilayer: 0.4-7.0 mm
Min. Solder Mask Bridge ≥ 0.08 mm
Aspect Ratio 15: 1
Via Plugging Capability 0.2 - 0.8 mm
5. Quality Standards & Tolerances
Parameter / Test Standard Tolerance / Value
Plated Hole Tolerance ± 0.08 mm (Min ± 0.05 mm)
Non-Plated Hole Tolerance ± 0.05 mm (Min +0/-0.05 mm or +0.05/-0 mm)
Outline Routing Tolerance ± 0.15 mm (Min ± 0.10 mm)
Insulating Resistance 50 MΩ (Normality)
Peel Off Strength 1.4 N/mm
Thermal Stress Test 265 °C, 20 Seconds
Solder Mask Hardness 6H
E-Test Voltage 500 V (+15/-0 V), 30s
Warp and Twist ≤ 0.7% (Semiconductor Test Board ≤ 0.3%)
1. Executive Summary & Core Values
At SNT, our focus on high-quality, economically viable systems combined with unmatched consistency makes us your premier choice. With a customer-centric mindset, SNT provides a turnkey stop for infinite solutions-from customized designs and PCB layouts to power stencils, soldering, fabrication, assembly, heatsinks, thyristors, triacs, varistors, switches, capacitors, and rectifiers.
Our core organizational values drive every project:
1.1 Sincerity: Building transparent, long-term partnerships with complete integrity.
1.2 Flexibility: Adapting seamlessly to customized client designs and changing requirements.
1.3 Implementation: Executing manufacturing workflows with absolute precision and speed.
1.4 Innovation: Continuously refining technology to deliver state-of-the-art PCB solutions.
2. Electronics Manufacturing Services (EMS) & Capabilities
SNT delivers an end-to-end service suite engineered to streamline your production lifecycle:
2.1 PCB Fabrication & Prototyping: Production ranging from standard boards to ultra-high layer counts.
2.2 PCB Assembly (PCBA): Advanced SMT and Through-Hole assembly for fine-pitch BGA components.
2.3 Engineering Assistance: Comprehensive DFM and DFA support to optimize design efficiency and yield.
2.4 Test & Inspection Services: Full E-test, AOI, and functional testing to guarantee zero-defect delivery.
2.5 Electronic Parts Supply & Logistics: Robust supply chain management for active and passive components.
3. Material Capabilities & Surface Finishes
We maintain a versatile substrate inventory and offer precise surface finishing options:
3.1 Base Substrates: Standard FR4 (Shengyi, ITEQ, KB A+), High-TG, Fr06, and RF materials including Rogers, Taconic, Argon, Naclo, and Isola.
3.2 Specialized Product Types: High-Frequency (HF/RF) boards, Controlled Impedance, HDI, and BGA/Fine-Pitch boards.
3.3 Solder Mask Options: Premier Nanya & Taiyo LPI or Matt finishes in red, green, yellow, white, blue, and black.
3.4 Surface & Selective Finishes: HASL, Lead-Free HASL, ENIG, OSP, Immersion Tin/Silver, Hard Gold, and hybrid combinations (e. g., ENIG + Gold Finger).
4. Technical Specifications
Technical Parameter / Specification Limits
Layer Count 1 - 28 Layers
Copper Thickness 1 - 6 oz
Min. Line Width / Gap 3.5 / 4 mil (Laser Drill)
Min. Hole Size 0.15 mm (Mechanical) / 4 mil (Laser)
Min. Annular Ring 4 mil
Max. Production Size 600 mm × 800 mm
Board Thickness (D/S & Multilayer) Double: 0.2-7.0 mm Multilayer: 0.4-7.0 mm
Min. Solder Mask Bridge ≥ 0.08 mm
Aspect Ratio 15: 1
Via Plugging Capability 0.2 - 0.8 mm
5. Quality Standards & Tolerances
Parameter / Test Standard Tolerance / Value
Plated Hole Tolerance ± 0.08 mm (Min ± 0.05 mm)
Non-Plated Hole Tolerance ± 0.05 mm (Min +0/-0.05 mm or +0.05/-0 mm)
Outline Routing Tolerance ± 0.15 mm (Min ± 0.10 mm)
Insulating Resistance 50 MΩ (Normality)
Peel Off Strength 1.4 N/mm
Thermal Stress Test 265 °C, 20 Seconds
Solder Mask Hardness 6H
E-Test Voltage 500 V (+15/-0 V), 30s
Warp and Twist ≤ 0.7% (Semiconductor Test Board ≤ 0.3%)
Authentication
Address:
Room 205, Block 1-8, Phase I, Vanke Jinyu Huafu, Mintai Community, Minzhi Sub-district, Longhua District, Shenzhen
Main Markets:
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Average Lead Time:
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Nearest Port:
Shenzhen, Hong Kong Victoria Harbour, Others
Solutions
OEM/ODM
Factory Tour
Sample Order